The technical application and function of the cutter wheel

Generally, in the process of cutting brittle material substrates such as glass substrates (hereinafter also referred to as 'substrates'), the following method is commonly referred to as: pressing a cutting wheel against the surface of the substrate to form a scribe line, and then, scribing the line External force is applied from the back to bend the wire to cut the substrate according to the unit substrate. Next, the editor will take you to understand the technical application and function of the cutter wheel.

A cutter head for processing scribing on brittle material base material, characterized in that: the cutter head has a V-shaped cutting edge, the V-shaped cutting edge by two along a diameter of 1 to 4
The sloping surface intersecting the circumferential surface of the circular plate body of mm is formed, and there is a supporting hole for installation in the middle.

There is a cutter head (hereinafter referred to as 'ordinary cutter head') that smoothly forms a cutting edge ridge, and a blade (hereinafter abbreviated as 'groove') with grooves (cuts) of predetermined pitches on the cutting edge ridge wheel. In the latter groove-shaped cutter head, the pitch of the groove portion is usually formed at 20 to 200 μm, and the length in the cutting edge direction of the groove portion is formed at a ratio of 1.5 to 2.5 times the groove depth.

The scribe line S is formed by a plastic deformation zone and a vertical crack 8, which is the bite mark of the milling cutter wheel on the surface of the substrate, produced just below the plastic deformation zone and along the thickness of the substrate W Directional penetration, at a predetermined depth above the vertical crack.